2D material reshapes 3D electronics for AI hardware
Multifunctional computer chips have evolved to do more with integrated sensors, processors, memory and other specialized components. However, as chips have expanded, the time required to move information between functional components has also grown.
“Think of it like building a house,” said Sang-Hoon Bae, an assistant professor of mechanical engineering and materials science at the McKelvey School of Engineering at Washington University in St. Louis. “You build out laterally and up vertically to get more ...











