Novel NIST process is a low-cost route to ultrathin platinum films
A research group at the National Institute of Standards and Technology (NIST) has developed a relatively simple, fast and effective method of depositing uniform, ultrathin layers of platinum atoms on a surface.* The new process exploits an unexpected feature of electrodeposition of platinum—if you drive the reaction much more strongly than usual, a new reaction steps in to shuts down the metal deposition process, allowing an unprecedented level of control of the film thickness.
Platinum is a widely used industrial catalyst—in automobile catalytic converters and hydrogen ...










