Taking microelectronics to a new dimension
Metallic microstructures are the key components in almost every current or emerging technology. For example, with the next wireless communication standard (6G) being established, the need for advanced components and especially antennas is unbroken. The drive to yet higher frequencies and deeper integration goes hand in hand with miniaturization and fabrication technologies with on-chip capability. Via direct laser writing - an additive manufacturing technology that offers sub-micron precision and feature sizes - highly sophisticated and integrated components come into reach. One big advantage of direct laser writing is that it is not limited to the fabrication of planar structures but enables almost arbitrary 3D microstructures. This ...
















