3D reflector microchips could speed development of 6G wireless
ITHACA, N.Y. – Cornell University researchers have developed a semiconductor chip that will enable ever-smaller devices to operate at the higher frequencies needed for future 6G communication technology. The next generation of wireless communication not only requires greater bandwidth at higher frequencies – it also needs a little extra time. The new chip adds a necessary time delay so signals sent across multiple arrays can align at a single point in space-- without disintegrating. The team’s paper, ...
Read the release













