Bomar's New High Density BNC E-Snap Connectors Target Broadcast and Telecom Applications
Bomar Interconnect Products, Inc., a premier manufacturer and designer of quality connectors and accessories for RF, video and broadcast transmission, announced the addition of high density BNC connectors to their E-Snap Series of edgeboard RF connectors. Bomar's new 75-Ohm high density BNC interconnects are 51% smaller than traditional BNC devices, permitting four times the density, and 40% smaller than the DIN 1.0/2.3. Their small form factor allows engineers to design more connections into less space while maintaining the stringent performance and reliability characteristics ...