OFC conference to showcase energy-efficient optical links that result in faster, low-power photonic chips
Researchers have demonstrated an integrated optical link on a silicon wafer that exhibits high-speed data transmission with very low power consumption. The advance, which was possible because of new low-energy membrane photonic devices made from indium phosphide, could help improve the power efficiency of integrated photonic circuit boards and chip packages without compromising speed. Tatsurou Hiraki from NTT Corporation in Japan will present this research at OFC, the premier global event for optical communications and networking, which will take place 30 March – 03 April 2025 at the Moscone Center ...
Read the release












