Thick Film Materials require Engineering and Manufacturing, as well as an Excellent Technical Service Manager

NEW YORK, NY, December 16, 2010

Retaining an HNC in Applied Physics from Slough-UK in 1975, Mr. Whitmarsh worked in the production of II-VI semiconductors (with Mining and Chemical Products Ltd) and researched into platinum group metals (with Johnson Matthey), and spent a short period of time producing thick film hybrid circuits for Waycom (now Corintech Hybrids). For the past twenty five years he has been Technical Service Manager at ESL Europe (http://www.electroscience.com/), manufacturers of think film pastes for the microelectronic industry. This involves supplying technical information to Sales staff worldwide, solving processing problems, and building prototypes.

Mr. Whitmarsh relates his responsibilities to the applications of thick film materials, involving a large sum of engineering and problem solving. He considers the most important and crucial part of his job to communicate what is to be done as well as what has been done so that problems are solved and no work is repeated by careful planning and organization. This necessitates a great deal of thinking, listening, reading as well as talking and writing. Mr. Whitmarsh is dedicated to the uses of thick film pastes in any electronic circuitry, the support of sales to this end, and the development of new technology within the ESL group.

"My responsibilities have included a certain amount of fire fighting..." Mr. Whitmarsh humors, "but these days more and more time is spent on information dissemination especially via the website http://www.electroscience.com." ESL ElectroScience has continuously supplied materials for the fabrication of thick film circuits since its formation in 1962. Having many years' experience in thick film materials and their applications, Mr. Whitmarsh is able to answer queries about traditional uses of thick film materials and has run many courses to teach newcomers the basics of the technology. Many of the traditional products are processed at 500°C or 850°C but he notes with great interest the move towards plastic electronics (low temperature processing) and high temperature cofired ceramic (HTCC). Articles on these technologies, and others like aluminum as an alternative to steel as a substrate and flexible polymer silvers for smart card, touch panel display and thin film solar cells, appear on the ESL ElectroScience website.

Along with his affiliation with Emerald Who's Who for Professionals and Executives (http://www.emeraldwhoswho.com/), Mr. Whitmarsh is also a member of the International Microelectronics and Packaging Society (IMAPS), and has received an Emerald Literati Network 2010 award for a paper that appeared in Microelectronics International. He is looking to network with all kinds of professionals, especially those in emerging and green technologies as "there is so much to learn".

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